News
18/09/2023 |
New BG24 CSP Brings AI/ML to Medical ApplicationsLast year, we introduced the industry’s first wireless SoCs with built-in AI/ML hardware accelerators, our xG24 families of SoCs. The xG24 has been a game changer for our customers building Matter-certified devices, multiprotocol operations, Bluetooth LE applications, and more. We’re excited to share that the BG24 now comes in a chip scale package (CSP). Let’s […] |
12/09/2023 |
Infineon presents XENSIV™ tire pressure sensor with intelligent features for tire pressure monitoring systemsMunich, Germany – 12 September, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) combines its proven automotive expertise with its patented glass-silicon-glass MEMS sensor for the automotive tire pressure monitoring system (TPMS) market to launch the XENSIV™ SP49 tire pressure monitoring sensor. The sensor integrates MEMS sensors and ASIC and provides smart tire […] |
22/08/2023 |
FG23 Wireless Sub-GHz SoCSilicon Labs’ wireless sub-GHz SoC enables Amazon Sidewalk, mioty, Wireless M-Bus, and Z-Wave Silicon Labs’ FG23 is the industry’s first wireless sub-GHz SoC with an Arm® Cortex®-M33, a dedicated security core and Arm PSA3 certification. The device improves on the leading RF performance of Series 1 and now enables 10+ year coin cell battery operation. The […] |
22/08/2023 |
Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUsMunich, Germany – 10 August, 2023 – The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming […] |
22/08/2023 |
Automotive motor control: New MOTIX™ MCU embedded power IC-families with CAN FD interface provide faster communication and higher performanceMunich, Germany – 07 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX™ MCU embedded power ICs. By integrating a gate driver, microcontroller, communication interface and power supply on a single chip, Infineon’s system-on-chip solutions achieve a minimal […] |
22/08/2023 |
Infineon adds 650 V TOLL portfolio to its CoolSiC™ MOSFET family for better thermal performance, power density, and easier assemblyMunich, Germany – 19 July, 2023 – As digitalization, urbanization, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels. Acknowledging energy efficiency as an important concern, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses these megatrends with its silicon carbide (SiC) CoolSiC™ […] |