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Infineon New 4.5 kV XHP™ 3 IGBT module enables downsizing of drives combined with maximum efficiency
04/01/2024The paradigm shift towards offloading complexity to suppliers and adopting smaller IGBT modules is evident in various applications. In response to the global push for downsizing and integration, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 4.5 kV XHP™ 3 IGBT modules that will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies. Applications benefiting from the new devices include large conveyor belts, pumps, high-speed trains, locomotives, as well as commercial, construction and agricultural vehicles (CAV).
The XHP family comprises a 450 A dual IGBT module with TRENCHSTOP™ IGBT4 and an emitter-controlled diode, and a 450 A double diode module with emitter-controlled E4 Diode. Both modules feature improved isolation of 10.4 kV. Together, they help to simplify paralleling and downsizing without sacrificing efficiency. Previously, complex busbars were required to parallelize switching modules, resulting in complicated design efforts and leakage inductance. The innovative design of the XHP family simplifies paralleling by conveniently placing the connections side by side. As a result, only a single straight busbar is required for paralleling.
The 4.5 kV XHP family also allows developers to reduce the number of units. Conventional IGBT solutions use multiple single switches and a double diode. With the new devices, however, designs can be reduced to two dual switches and a smaller double diode – a significant step forward in integrated drives.
The combination of the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 double diode enables significant cost savings and a smaller footprint. For example, Infineon’s previous IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and one 140 x 130 mm² double diode. With the new XHP family, the components can be reduced to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² double diode.
XHP™ 2 and 3 – Reach the next level of flexibility and scalability
Its latest portfolio extension the first of its kind 4.5 kV half-bridge and diode XHP™: FF450R45T3E4_B5 & DD450S45T3E4_B5 are the key enabler to the global trend of integrated 2000-3300 V AC drives.
XHP™ is the new flexible IGBT module platform for high-power applications. Ranging from 1.7 kV to 6.5 kV, the XHP™ presents an excellent solution for demanding applications like traction, CAV and medium-voltage drives. The module allows for scalable design with best-in-class reliability and highest power density.
The modules comes in two housings, XHP™ 2 and XHP™ 3. Both have the same dimensions, 140 mm in length, 100 mm in width and 40 mm in height. This gives product designers the opportunity to build homogenous solutions across different current and voltage ratings in order to implement optimized power converter concepts. A main focus in development of the new platform was to achieve the flexibility and reliability while assuring optimal integration into customer systems.
Highlights
Flexible high-power platform
Power modules have proven to be the driving force behind the rapid development in the area of power electronic systems technology, particularly in terms of energy savings, control dynamics, noise reduction as well as weight and volume reduction. Power semiconductors are primarily used to control the energy flow between energy generation and consumption. This is done extraordinary precisely and with exceptionally low losses. Continued progress in the performance of power semiconductors drives demand for corresponding improvements in packaging technology. We have contributed to this evolution across more than two decades.
The new housing for high-power IGBT modules is designed to cover the full-voltage range of IGBT chips from 3.3 to 6.5 kV. One key innovation is its scalability, which will greatly simplify system design and manufacturing. Additionally, due to its robust architecture, the new high-power platform will provide long-term reliability in applications with demanding environmental conditions.
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