News
New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications
10/04/2024Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance. This eliminates heat transfer into or through the PCB of the automotive electronic control unit. The package enables a simple and compact double-sided PCB design and minimizes cooling requirements and system costs for future automotive power designs. The SSO10T TSC is therefore well suited for applications such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DCDC converters.
The SSO10T TSC has a 5 x 7 mm² footprint and is based on the established industry standard SSO8, a 5 x 6 mm² robust housing. However, due to its top-side cooling, the SSO10 TSC offers more than 20 percent and up to 50 percent higher performance than the standard SSO8 – depending on the thermal interface (TIM) material used and the TIM thickness. The SSO10T TSC package is JEDEC listed for open market and provides wide second source compatibility. As a result, the package can be introduced quickly and easily as the future standard for top-side cooling.
The SSO10T package enables a very compact PCB design and reduces the system footprint. It also lowers the cost of the cooling design by eliminating vias, resulting in lower overall system costs and design effort. At the same time, the housing offers high power density and efficiency, thus supporting the development of future-proof and sustainable vehicles.
SSO10 TSC top side cooling 5×7 offers more than 20% up to 50% higher power capability than comparable industry standard SSO8 5×6 bottom side cooled package
Related products
Product name | Status | Voltage (V) | RDS(on) (max) [mΩ] | ID @25°C (max) [A] |
IAUCN04S6N007T | active and preferred | 40 | 0.75 | 120 |
IAUCN04S6N009T | active and preferred | 40 | 0.90 | 120 |
IAUCN04S6N013T | active and preferred | 40 | 1.32 | 120 |
IAUCN04S6N017T | active and preferred | 40 | 1.73 | 120 |
-
22/08/2023
FG23 Wireless Sub-GHz SoC
Silicon Labs’ wireless sub-GHz SoC enables Amazon Sidewalk, mioty, Wireless M-Bus, and Z-Wave Silicon Labs’ FG23 is the industry’s first wireless sub-GHz SoC with an Arm® Cortex®-M33, a dedicated security core and Arm PSA3 certification. The device improves on the leading RF performance of Series 1 and now enables 10+ year coin cell battery operation. The […]
-
23/08/2023
STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band
Description STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band. The STEVAL-IDS001V4 demonstration board is based on the SPIRIT1, which is a sub-GHz low power, low data-rate transceiver suitable for ISM bands and Wireless M-BUS. The board is equipped with an STM32L low power microcontroller to control the […]
-
22/08/2023
Silicon Labs xG28 Now Available; Helping Customers Like Chamberlain Group and Honeywell with Long-Range Applications at the Edge
In June, we announced our dual-band FG28 SoC, designed for long-range networks and protocols like Amazon Sidewalk, Wi-SUN, and other proprietary protocols. Today, we’re excited to share that the FG28 is now generally available through Silicon Labs and our distribution partners. Learn more about the dual-band FG28 SoC here. We’re also extending our xG28 family of SoCs with the ZG28, […]
-
31/07/2023
FG25 Sub-GHz SoC Now Available for Smart Cities and Long-Range Deployments
During our Works With 2022 Developer Conference, we announced our new flagship sub-Ghz SoC, the FG25, and today we are pleased to announce that it is generally available through Silicon Labs and our distribution partners. The FG25 is the ideal SoC (system on chip) for long-range, low-power transmissions, capable of broadcasting up to 1.6km with minimal data […]
-
31/07/2023
Smart City Living Lab Series: Making Hyderabad, India a Smarter City with Wi-SUN
Specifically designed for smart cities, Wireless Smart Ubiquitous Network (Wi-SUN) is a protocol for low-power Internet of Things (IoT) mesh networks. With its scalability, security, interoperability, and support for a wide range of existing and emerging apps, Wi-SUN is an excellent foundation for sustainable city operations and, ultimately, better quality of life for residents. Cities around […]
-
27/07/2023
Smart City Living Lab Wi-SUN FAN 1.1 Mesh Deployment – Phase 2
As part of the ongoing blog series on the Smart City Living Lab at IIIT Hyderabad, this second post will delve deeper into the details of the inner workings of the state-of-the-art Wi-SUN-enabled Smart City Living Lab. The lab, which stands as a testament to the immense potential of IoT in daily life, mirrors a Smart City on […]