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New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications

10/04/2024

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance. This eliminates heat transfer into or through the PCB of the automotive electronic control unit. The package enables a simple and compact double-sided PCB design and minimizes cooling requirements and system costs for future automotive power designs. The SSO10T TSC is therefore well suited for applications such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DCDC converters.

The SSO10T TSC has a 5 x 7 mm² footprint and is based on the established industry standard SSO8, a 5 x 6 mm² robust housing. However, due to its top-side cooling, the SSO10 TSC offers more than 20 percent and up to 50 percent higher performance than the standard SSO8 – depending on the thermal interface (TIM) material used and the TIM thickness. The SSO10T TSC package is JEDEC listed for open market and provides wide second source compatibility. As a result, the package can be introduced quickly and easily as the future standard for top-side cooling.

The SSO10T package enables a very compact PCB design and reduces the system footprint. It also lowers the cost of the cooling design by eliminating vias, resulting in lower overall system costs and design effort. At the same time, the housing offers high power density and efficiency, thus supporting the development of future-proof and sustainable vehicles.

New! SSO10T TSC – Top Side Cooling Package with OptiMOS™ Technology

Infineon introduces its new top side cooling package SSO10T TSC in combination with its leading edge OptiMOS™ MOSFET technology.

SSO10T TSC offers excellent thermal performance by a direct top side cooling concept. No more heat transfer into or through the PCB.

It enables an easy and compact double side PCB design, it minimizes cooling effort and system costs for future Automotive power designs.

The footprint of the SSO10T TSC has 5mm x 7mm and is based on the established industry standard SSO8 5mm x 6mm robust package.

SSO10T TSC can be used for a wide variation of tomorrows Automotive applications like EPS, Braking, Power Distribution, BLDC drives etc.

The SSO10T TSC package is JEDEC listed for open market use and wide 2nd source compatibility

Introduction to Infineon’s automotive MOSFET in SSO10T TSC package

Infineon has been expanding the package portfolio for it’s high-performing OptiMOS™ MOSFETs. Do you know SSO10T, the latest addition to Infineon’s package family for OptiMOS™ MOSFETs?

Key features

  • Direct cooling path to ECU housing
  • Improves Zth by -20% up to -50%
  • Improves Rth by -20% up to -50%
  • Enables double sided PCB design
  • Provides higher application currents
  • SSO10T TSC is JEDEC listed for open market and 2nd source compatibility

Key benefits

  • Best Cooling Performance
  • Not heat transfer into PCB
  • Very compact PCB design
  • Reduces system area
  • Reduces cooling efforts & costs
    (no more vias)
  • Reduces system costs & design efforts
  • High power density & efficiency

Key applications

  • Electric power steering
  • Power disconnect switches
  • Zone control units
  • E-fuse box
  • DC/DC
  • ABS Braking, e-Booster
  • all automotive applications
  • BLDC drives in a wide variety

SSO10 TSC top side cooling 5×7 offers more than 20% up to 50% higher power capability than comparable industry standard SSO8 5×6 bottom side cooled package

Related products

Product name Status Voltage (V) RDS(on) (max) [mΩ]  ID  @25°C (max) [A] 
IAUCN04S6N007T active and preferred 40 0.75 120
IAUCN04S6N009T active and preferred 40 0.90 120
IAUCN04S6N013T active and preferred 40 1.32 120
IAUCN04S6N017T active and preferred 40 1.73 120
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