News
NXP and TSMC to Deliver Industry’s First Automotive 16 nm FinFET Embedded MRAM
18/09/2023- NXP and TSMC jointly develop embedded MRAM IP in TSMC 16 nm FinFET technology
- With MRAM, carmakers can more efficiently roll out new features, accelerate over-the-air (OTA) updates and remove production bottlenecks
- NXP’s next generation of S32 zonal processors and general purpose automotive MCUs are scheduled to be the first product to sample in early 2025
EINDHOVEN, The Netherlands, May 16, 2023 (GLOBE NEWSWIRE) — NXP Semiconductors (NASDAQ: NXPI), the world leader in automotive processing, today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology. As automakers transition to software-defined vehicles (SDVs), they need to support multiple generations of software upgrades on a single hardware platform. Bringing together NXP’s high-performance S32 automotive processors with fast and highly reliable next-generation non-volatile memory in 16 nm FinFET technology provides the ideal hardware platform for this transition.
MRAM can update 20MB of code in ~3 seconds compared to flash memories that take about 1 minute, minimizing the downtime associated with software updates and enabling carmakers to eliminate bottlenecks that arise from long module programming times. Moreover, MRAM provides a highly reliable technology for automotive mission profiles by offering up to one million update cycles, a level of endurance 10x greater than flash and other emerging memory technologies.
SDVs enable carmakers to roll out new comfort, safety and convenience features via over-the-air (OTA) updates, extending the life of the vehicle and enhancing its functionality, appeal, and profitability. As software-based features become more widespread in vehicles, the frequency of updates will increase, and MRAM’s speed and robustness will become even more important.
TSMC’s 16FinFET embedded MRAM technology exceeds the rigorous requirements of automotive applications with its one-million cycle endurance, support for solder reflow, and 20-year data retention at 150°C.
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22/08/2023
FG23 Wireless Sub-GHz SoC
Silicon Labs’ wireless sub-GHz SoC enables Amazon Sidewalk, mioty, Wireless M-Bus, and Z-Wave Silicon Labs’ FG23 is the industry’s first wireless sub-GHz SoC with an Arm® Cortex®-M33, a dedicated security core and Arm PSA3 certification. The device improves on the leading RF performance of Series 1 and now enables 10+ year coin cell battery operation. The […]
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23/08/2023
STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band
Description STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band. The STEVAL-IDS001V4 demonstration board is based on the SPIRIT1, which is a sub-GHz low power, low data-rate transceiver suitable for ISM bands and Wireless M-BUS. The board is equipped with an STM32L low power microcontroller to control the […]
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22/08/2023
Silicon Labs xG28 Now Available; Helping Customers Like Chamberlain Group and Honeywell with Long-Range Applications at the Edge
In June, we announced our dual-band FG28 SoC, designed for long-range networks and protocols like Amazon Sidewalk, Wi-SUN, and other proprietary protocols. Today, we’re excited to share that the FG28 is now generally available through Silicon Labs and our distribution partners. Learn more about the dual-band FG28 SoC here. We’re also extending our xG28 family of SoCs with the ZG28, […]
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31/07/2023
FG25 Sub-GHz SoC Now Available for Smart Cities and Long-Range Deployments
During our Works With 2022 Developer Conference, we announced our new flagship sub-Ghz SoC, the FG25, and today we are pleased to announce that it is generally available through Silicon Labs and our distribution partners. The FG25 is the ideal SoC (system on chip) for long-range, low-power transmissions, capable of broadcasting up to 1.6km with minimal data […]
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31/07/2023
Smart City Living Lab Series: Making Hyderabad, India a Smarter City with Wi-SUN
Specifically designed for smart cities, Wireless Smart Ubiquitous Network (Wi-SUN) is a protocol for low-power Internet of Things (IoT) mesh networks. With its scalability, security, interoperability, and support for a wide range of existing and emerging apps, Wi-SUN is an excellent foundation for sustainable city operations and, ultimately, better quality of life for residents. Cities around […]
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27/07/2023
Smart City Living Lab Wi-SUN FAN 1.1 Mesh Deployment – Phase 2
As part of the ongoing blog series on the Smart City Living Lab at IIIT Hyderabad, this second post will delve deeper into the details of the inner workings of the state-of-the-art Wi-SUN-enabled Smart City Living Lab. The lab, which stands as a testament to the immense potential of IoT in daily life, mirrors a Smart City on […]