News
PCB engineering support
22/08/2023
Our OEM factory was established in the year of 2006, started operation in the year of 2012, and was listed on the Shenzhen Stock Exchange Growth Enterprise Market in August 2022; products mainly apply in automotive electronics (new energy electric vehicles, traditional automotive parts), communication electronics, industrial control, consumer electronics, medical devices, etc; terminal clients include HUAWEI, ZTE, Siemens, Honeywell, ABB, etc. Our OEM factory mainly focuses on automotive PCB market, and occupies a high market share with relatively strong competitive advantage especially in the new energy vehicle PCB field; products are ultimately used in Tesla, BMW, Audi, Mercedes-Benz, NIO, Xiaopeng, Leading Ideal, Geely, Great Wall, Dongfeng, Chery, Volkswagen, Toyota, Chrysler, Nissan, Peugeot-Citroen, Hyundai, Yutong and other well-known automotive brand .
At present, our OEM factory has formed two production bases in Qingyuan of Guangdong and Anlu of Hubei, and plans to form PCB production capacity of total 8 million m2 per year. Production base in Qingyuan covers an area of 82 thousand m2，with a planning PCB production capacity of 4 million m2 per year. Production base in Anlu of Hubei covers an area of about 261 thousand m2, puts up with industry 4.0 concept to construct a PCB intelligent factory, plans to form an annual production capacity of 4 million m2 HDI (high-density interconnection) and rigid-flex PCB matching for high-end new energy automotive product.
Our OEM factory aims to serve the technological changes and industrial upgrades, to provide high-quality PCB for the global electronics and emerging industries. adhering to the spirit of “united, struggling, honest, enterprising, innovative, sharing”, we is committed to become the global new energy vehicle print circuit board field’s first-class manufacturer and a well-known enterprise with strong competitiveness in the domestic PCB industry.
Our OEM factory also awarded the title of National High-tech Enterprise, China’s Top 100 PCB Enterprise, and Print Circuit Board Engineering Technology Research and Development Center of the Guangdong Province, China’s Top1 BMS PCB
Technology Capacity
| Production Capability | o Layer ： Sample: 26layer
Production: 20layer o Board Thickness ：0.3~5.0mm o Copper thicnkess ：1/3~6oz o Drilling ：0.1~ ∞ o Trace W/S : 0.075mm/0.075mm o Dimension：600*860mm o Aspect ratio ：12:1 o Impedance tolerance：+/-8% |
| Surface Finish | Immersion Gold, ImmersionTin/Silver, Gold finger plating, Selective surface finish(OSP +Immersion Gold/OSP+ Hardgold fingers), OSP, Carbon, High-Temp tape |
| Laminate Material | Low-TG, Mid-TG, High-TG, Middle loss, Low loss
ShengYi, King Board, GoWorld, WAZAM, JinBao, EMC, TUC, NanYa, Ventec, ITEQ, Isola, Rogers, Panasonic |
| Special Process | Long and short golden fingers,
Graded golden fingers, Depth control mechanical drilling, Back drill, Electroplating filling via, Mechanical blind hole, HDI, Buried copper block, Multilayer mixed laminate, POFV, Rigid-Flexible PCB , Etc… |
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22/08/2023
FG23 Wireless Sub-GHz SoC
Silicon Labs’ wireless sub-GHz SoC enables Amazon Sidewalk, mioty, Wireless M-Bus, and Z-Wave Silicon Labs’ FG23 is the industry’s first wireless sub-GHz SoC with an Arm® Cortex®-M33, a dedicated security core and Arm PSA3 certification. The device improves on the leading RF performance of Series 1 and now enables 10+ year coin cell battery operation. The […]
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23/08/2023
STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band
Description STEVAL-IDS001V3, Demonstration Board based on the SPIRIT1 Low data-rate, short-range USB dongle transceiver in 433-MHz band. The STEVAL-IDS001V4 demonstration board is based on the SPIRIT1, which is a sub-GHz low power, low data-rate transceiver suitable for ISM bands and Wireless M-BUS. The board is equipped with an STM32L low power microcontroller to control the […]
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22/08/2023
Silicon Labs xG28 Now Available; Helping Customers Like Chamberlain Group and Honeywell with Long-Range Applications at the Edge
In June, we announced our dual-band FG28 SoC, designed for long-range networks and protocols like Amazon Sidewalk, Wi-SUN, and other proprietary protocols. Today, we’re excited to share that the FG28 is now generally available through Silicon Labs and our distribution partners. Learn more about the dual-band FG28 SoC here. We’re also extending our xG28 family of SoCs with the ZG28, […]
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31/07/2023
FG25 Sub-GHz SoC Now Available for Smart Cities and Long-Range Deployments
During our Works With 2022 Developer Conference, we announced our new flagship sub-Ghz SoC, the FG25, and today we are pleased to announce that it is generally available through Silicon Labs and our distribution partners. The FG25 is the ideal SoC (system on chip) for long-range, low-power transmissions, capable of broadcasting up to 1.6km with minimal data […]
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31/07/2023
Smart City Living Lab Series: Making Hyderabad, India a Smarter City with Wi-SUN
Specifically designed for smart cities, Wireless Smart Ubiquitous Network (Wi-SUN) is a protocol for low-power Internet of Things (IoT) mesh networks. With its scalability, security, interoperability, and support for a wide range of existing and emerging apps, Wi-SUN is an excellent foundation for sustainable city operations and, ultimately, better quality of life for residents. Cities around […]
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27/07/2023
Smart City Living Lab Wi-SUN FAN 1.1 Mesh Deployment – Phase 2
As part of the ongoing blog series on the Smart City Living Lab at IIIT Hyderabad, this second post will delve deeper into the details of the inner workings of the state-of-the-art Wi-SUN-enabled Smart City Living Lab. The lab, which stands as a testament to the immense potential of IoT in daily life, mirrors a Smart City on […]